Global Outreach and Extended Education

Master of Engineering

Area of Study: Microelectronics Packaging

Program Sections:

Click Section Title to Expand or Close Section

Program Overview

The Master of Engineering degree offers an area of study in Microelectronics Packaging at Arizona State University. Microelectronic package design and assembly are critical components of high-quality CPU, networking, and memory products. No longer focusing on a single performance characteristic, packaging engineers today must solve complex, coupled problems that require fundamental understanding of electrical, thermal, mechanical, material science, and manufacturing principles.

This area of study will provide fundamental and advanced courses to educate both novice and experienced engineers on these topics. Through an innovative collaboration between Intel Corporation and ASU Fulton School of Engineering, students learn packaging principles and analysis tools through direct interaction with experts from Intel Corporation and renowned ASU faculty. Future packaging programs require engineers to become even more aware of --and capable of solving-- multi-disciplinary problems. In this program track, students will have an opportunity to develop a curriculum across disciplines.

Program Overview Presentation

Download a PowerPoint Presentation Overview

Admission Requirements

Students seeking admission into the program must hold a bachelor of science in engineering or math. Applicants must have a minimum grade point average of 3.0 in the last 60 undergraduate credit hours. No GRE is required.

Program Requirements

Students must complete a total of 30 credit hours equaling 10 courses to earn a Masters of Engineering Degree. Additional requirements are as follows:
Students are required to complete MSE 598 Microelectronics Packaging (3-credits).
Students must complete a minimum of three advanced packaging courses.
Students can select electives across the disciplines. At least one course in two of the four disciplines. at least two courses in one of the four disciplines.
A culminating event is required and will be identified by the student’s advisory committee. It could be a final examination or the final report for a practice-oriented project (Applied Project XXX593). Additional requirements may exist for some academic units.
Students can elect to complete an applied project and receive up to six credit hours. The applied project can substitute for 3 to 6 credit hours upon approval by the advisor.
Students can pursue course work from University of Arizona or Northern Arizona University through the Master of Engineering Partnership (upon advisor approval).
The Master of Engineering program requires a math and a business course. (**Satisfies Management Requirement; *Satisfies Math Requirement)

Program of Study - Leveling & Core Courses

Leveling Courses:

Students enrolling in advanced courses outside of their bachelor's major might be required to complete a prerequisite leveling course. The leveling courses can be used as an elective within the final program of study and approved by the program advisor.

EEE 498/598 Overview of Electrical Engineering
MAE 498/598 Heat Transfer
MSE 498/598 Overview of Materials Engineering
MAE 498/598 Overview of Mechanical Engineering
IEE 498/598 Designed Experiments, Statistical Process Control, and Statistical Reasoning

Required Core Courses

MSE 498/598 Microelectronics Packaging

Advanced Packaging Core Courses (Three Courses Required)

EEE 691 Advanced Packaging Analysis & Design: Electrical Considerations
MAE 691 Advanced packaging Analysis & Design: Mechanical Engineering Considerations
MAE 602 Advanced Packaging Analysis & Design: Thermal Considerations
MSE 691 Advanced Packaging Analysis & Design: Materials Engineering Considerations
IEE 691 Advanced Analysis Methods**

Proposed Schedule of Leveling and Core Classes

Download Schedule (PDF Format)

Program of Study - Elective Courses

Elective Courses

Students can select electives across the disciplines. At least one course in two of the four disciplines and at least two courses in one of the four disciplines.

Electrical Engineering Electives:

EEE 440: Electromagnetic Engineering II
EEE 436: Fundamentals of Solid State Devices
EEE 530: Advanced Silicon Processing
EEE 531: Semiconductor Device Theory I
EEE 532: Semiconductor Device Theory II
EEE 541: Electromagnetic Fields and Guided Wave
EEE 598: Microelectromechanical Systems (MEMS)
EEE 641: Advanced Electromagnetic Field Theory
EEE 643: Advanced Topics in Electromagnetic Radiation

Mechanical Engineering

MAE 520: Solid Mechanics
MAE 527: Finite Element Methods in Engineering Science
MAE 544: Mechanical Design and Failure Prevention
MAE 557: Mechanics of Composite Materials
MAE 589: Heat Transfer

Industrial Engineering:

IEE 500: Research Methods: Engineering Statistics*
IEE 569: Advanced Statistics Methods*
IEE 572: Design of Engineering Experiments*
IEE 573: Reliability Engineering
IEE 582: Response Surfaces and Process Optimization
IEE 598: DOE/SPC for Semiconductor Processes

Materials Engineering:

MSE 512: Analysis of Material Failures
MSE 513: Polymers and Composites
MSE 516: Mechanical Properties of Solids
MSE 517: Introduction to Ceramics
MSE 540: Fracture, Fatigue, and Creep
MSE 550: Advanced Materials Characterization
MSE 570: Polymer Structure and Properties
MSE 571: Ceramics
MSE 598: Electronic Thin Films

Chemical Engineering:

CHE 458: Semiconductor Material Processing
CHE 558: Electronic Materials

Other:

CSE 598: Modeling and Simulation