Semiconductor Faculty Certification Program

Explore the fundamentals of semiconductor packaging, essential for advancing integrated circuit technology and driving innovation in electronics manufacturing.

Apply now

These two Microcredentials are included in the ITSI Workforce Accelerator’s Semiconductor Faculty Certification Program. Faculty from ITSI partner countries are encouraged to view this flyer to learn more and request your institution to nominate you today. Faculty accepted into the program will begin by completing the microcredential listed below, followed by additional courses and workshops.

About the ITSI Workforce Accelerator: In collaboration with the U.S. Department of State’s Bureau of Economic and Business (EB) Affairs, Arizona State University (ASU) is implementing a program to help diversify the global semiconductor supply chain. This initiative is supported by the International Technology Security and Innovation (ITSI) Fund, established under the U.S. CHIPS and Science Act of 2022. The initiative seeks to expand semiconductor chip assembly, testing, and packaging (“ATP” or “downstream”) operations in key partner countries in the Americas (Mexico, Costa Rica, and Panama) and the Indo-Pacific (Indonesia, Philippines, and Vietnam), thereby fortifying a resilient supply chain for U.S. semiconductor manufacturers.

Semiconductor Packaging: Fundamental Concepts and Drivers Program Overview

Explore the heart of the electronics industry through our course tailored to unveil the mysteries of semiconductor packaging. Whether you're new or experienced in the field, this course delves into how semiconductor packaging safeguards and boosts the performance of the tiny chips powering our everyday gadgets.

Designed for professionals aiming to excel in their careers, this course arms you with specialized expertise to pioneer and manage semiconductor solutions. Get ready to turn theory into hands-on know-how as you dive into a curriculum that emphasizes real-world applications, covering everything from initial design to final testing. You'll not only tackle current industry challenges but also anticipate future advancements.

By enrolling, you'll not only expand your knowledge but also boost your job prospects by staying up-to-date with the latest trends and technologies in semiconductor packaging..

Key Skills Covered:

Understanding semiconductor packaging and design
Grasping electrical principles in semiconductor packaging
Basics of managing heat and understanding package durability
Familiarity with packaging materials, manufacturing processes, testing procedures, and reliability standards.

Learn more

Semiconductor Packaging, Assembly, and Test Program Overview

Cultivate a deep understanding of the semiconductor industry with the Semiconductor Packaging, Assembly, and Test. Explore the intricacies of semiconductor packaging, assembly processes, and rigorous testing methodologies, which are cornerstones of modern semiconductor manufacturing.

Designed for forward-thinking professionals ready to embrace the future of semiconductor manufacturing, this full badge equips you with practical skills to thrive in a rapidly evolving landscape. Dive into key topics such as 2D packaging, materials selection, thermo-mechanical modeling, and quality and reliability testing, and harness the power of advanced tools and platforms.

Key Skills Covered:

Understand 2D electronic packaging processes, chip packages, PC board assembly, and JEDEC/IPC standards.
Analyze thermo-mechanical and electrical properties, select appropriate materials, and apply material science to optimize package performance
Cultivate expertise in modeling techniques, explore thermal management solutions, and utilize powerful simulation tools
Acquire essential testing techniques, delve into effective failure analysis methods, and harness powerful tools for data analysis

Learn more

Faculty and course staff

Terry Alford

Terry Alford received his doctorate in materials science and engineering from Cornell University in 1991. He joined the Arizona State University faculty in 1993 and is currently a professor and associate director of the School for Engineering of Matter, Transport and Energy in the Ira A. Fulton School of Engineering. Professor Alford's teaching interests include X-ray and electron diffraction, introduction to physical materials science and laboratory, structure and properties of materials, advanced materials issues in semiconductor processing, and materials processing and synthesis. His areas of expertise include silver and copper metallization and low-k dielectrics for future integrated circuit (IC) technologies, advanced metallization for low-power electronics and for novel IC components formation, and adhesion of sol-gel hydroxyapatite-metal systems for biomedical.

Christopher Bailey

Christopher Bailey will join ASU as a professor in the School of Electrical, Computer and Energy Engineering. His research expertise is advanced semiconductor packaging, which focuses on multi-physics modeling and reliability. He is the junior-past president of the IEEE Electronics Packaging Society and associate editor for the IEEE Transactions of Components, Packaging, and Manufacturing Technology. Bailey also co-chairs the modeling and simulation technical working group on the Heterogeneous Integration Roadmap.

david-theodore

David Theodore

Dr Theodore received his PhD in materials science and engineering (with a minor in electrical engineering) from Cornell University. He worked as a Research Scientist in Materials, Process and Device R&D, and Materials Characterization, for 20+ years in the Semiconductor industry. He was recognized for his technical contributions as a Distinguished Member of the Technical Staff at Motorola Inc. He has 10+ years of experience teaching Materials Science, Semiconductor Materials, Advanced Materials Characterization courses at ASU. His teaching interests include applications for materials research, technology & process development, materials characterization, and industrial problem-solving.

david-theodore

Hongbin Yu

Professor Hongbin Yu joined the Arizona State University faculty in 2005. He received a doctorate in physics in 2001 from the University of Texas at Austin, and a master's degree in physics in 1996 from Peking University, P.R. China, and conducted his postdoctoral research at California Institute and Technology and University of California at Los Angeles. He is currently the overall Center Director of NSF IUCRC Center for Efficient Vehicles and Sustainable Transportation Systems (EVSTS: https://evsts.asu.edu). His areas of expertise include nanostructure and nano device fabrication and characterization; flexible, transparent and wearable electronics; wide bandgap semiconductor electronic and optoelectronics; quantum size effect in metallic and semiconducting nanostructures; integrated microwave and power devices, LiDAR and sensors for automotive applications. He is also a member of IEEE/ASME Heterogeneous Integration Roadmap Committee on Automotive Chapter.

FAQ's

What are stackable microcredentials?

Microcredentials are focused credentials with content designed to provide you with knowledge and specific skills in technical fields. A microcredential badge demonstrates proficiency in a specific skill or attainment of certain knowledge. Our micro-credentials are stackable towards aggregated skills in specific technical topic areas, offering varying levels of complexity (1-4) to provide you with the opportunity to “stack” your skills through into micro-badges and badges along specific topic areas within an emerging technology space!

What is the difference between a badge and a micro-badge?

A badge is earned when successfully completing four approved micro-badges within a specific topic area. A micro-badge is earned by successfully completing one short course and assessment, typically requiring 10 hours of instruction alongside 5-10 hours of additional study. Micro-badges are offered at four distinct levels, culminating with experiential learning activities to ensure you can apply the skills you gain!

How long does it take to earn a badge?

A badge is earned when you successfully complete four approved micro-badges within a specific topic area. Each micro-badge is estimated at 10-20 hours of learning time, equating to 40-80 hours for a full badge.

What do the levels of micro-badges mean?

Navigating the vast landscape of learning options can be daunting, which is why The Fulton Schools of Engineering created a clear and structured leveling system for Micro-badges. Micro-badges are offered in four levels and are designed to guide you through a seamless progression of knowledge and skills, ensuring that each builds upon the last. Whether you're just starting out or looking to advance your expertise, our Micro-badges offer a flexible and customizable learning pathway to suit your needs. Here's how our four levels work: Level 1: Foundational knowledge introduction. Level 2: Introductory practical application within the emerging technology space. Level 3: Skill refinement towards industry-relevant hardware or software. Level 4: Advanced technical skills and troubleshooting with industry-relevant hardware or software.

How will I receive my microcredential badges and micro-badges?

After successfully completing the requirements of the course. You will receive an email with instructions on accessing your digital badge. Badges can be proudly displayed digitally on social media and referenced on your resume.

When will more courses be offered?

We are committed to providing high-quality programs and are consistently working with faculty and industry experts to develop and deliver courses. We hope to offer more in the coming months and invite you to continue checking back for the latest offerings. If you have recommendations for future topics, please submit them here.

How can I offer a microcredential to groups of employees?

We are happy to work with you to design and deliver a program that addresses the needs of your workforce. In general, we offer a 10% discount to groups of 5 or more employees, and a 20% discount for 10+ employees. Please email us at exec-fseonline@asu.edu for more information on bulk discounts.

Can I enroll in multiple micro-badges simultaneously?

Yes, you can enroll in as many badges and micro-badges as you like. We recommend registering for the full badge offerings, which offer a discounted rate for the badge package.

Are there any prerequisites for each micro-badge level?

Depending on the course offering and level of microbadge, there may be skills required to support your success in the course. We recommend reviewing the micro-badge website description for the courses you are interested in, as some skills build upon prior knowledge.

How are stackable microcredentials different from traditional degree programs?

Stackable microcredentials are offered with the flexibility to directly enroll without an admissions process and do not currently provide college credit.

How will an employer know I earned a microcredential?

Proudly displaying your newly acquired skills on your resume and social media profile is easy to do! Simply download your badge and add it to your account to signal your skills to hiring managers. The badges can be easily shared on LinkedIn as a digitally verifiable badge.

Request information

First Name

Last Name

Email Address

Phone Number

Company

I have a question about

What is your question(s)?