Introduction to Semiconductor Packaging Design

Equip yourself with vital skills required in semiconductor design and packaging, essential for revolutionizing electronic component assembly and performance.

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This course is included in the ITSI Workforce Accelerator’s Semiconductor Faculty Certification Program. Faculty from ITSI partner countries are encouraged to view this flyer to learn more and request your institution to nominate you today. Faculty accepted into the program will begin by completing the microcredential listed below, followed by additional courses and workshops.

About the ITSI Workforce Accelerator: In collaboration with the U.S. Department of State’s Bureau of Economic and Business (EB) Affairs, Arizona State University (ASU) is implementing a program to help diversify the global semiconductor supply chain. This initiative is supported by the International Technology Security and Innovation (ITSI) Fund, established under the U.S. CHIPS and Science Act of 2022. The initiative seeks to expand semiconductor chip assembly, testing, and packaging (“ATP” or “downstream”) operations in key partner countries in the Americas (Mexico, Costa Rica, and Panama) and the Indo-Pacific (Indonesia, Philippines, and Vietnam), thereby fortifying a resilient supply chain for U.S. semiconductor manufacturers.

Introduction

This micro-badge is part of the Semiconductor Packaging: Fundamental Concepts and Drivers badge.

Join us for the Introduction to Semiconductor Packaging and Design micro-badge, a comprehensive course designed for professionals eager to explore the critical role of packaging in the functionality and reliability of semiconductors. This course provides an overview of semiconductor structures, packaging types, and the latest technological advancements, catering to those new to the field or looking to enhance their expertise.

This program will guide you through the nuances of semiconductor packaging—from basic concepts to advanced applications like 2D and 3D Die-to-Die Interconnects and Co-Packaging Optics. Whether you are a technician or an engineer, this course will equip you with the knowledge and skills necessary to excel in the fast-paced world of semiconductor technologies.

Key Skills Covered:

  • Understanding of Moore’s Law and its implications
  • Differentiation of semiconductor package types
  • Recognition of the role of packaging in technological advancements
  • Exploration of advanced semiconductor packaging solutions

Session Topics:

  • Nanoelectronics
  • What is packaging?
  • Anatomy of a package
  • Packaging trends
  • Heterogeneous integration

About the course

This course is offered live through Zoom. Instructional sessions will be held:

  • Tuesday, September 3, 2024, 5:30–9 p.m. MST
  • Wednesday, September 4, 2024, 5:30–9 p.m. MST
  • Thursday, September 5, 2024, 5:30–8:30 p.m. MST

Micro-Badge Level:

This course is offered at level 1. Level 1 micro-badges provide foundational knowledge suitable for learners with no prior experience in the field.

What You’ll Earn:

Participants will earn a micro-badge by completing each micro-badge session and included assessment. Micro-badges are designed with a culminating experiential learning activity ensuring participants can apply the skills learned throughout the course. By completing this micro-badge, participants will also qualify for Continuing Education Units (CEU).

​As one of the world's top-ranked engineering schools, the Ira A. Fulton Schools of Engineering is recognized globally as a premier provider of qualifications.

Pre-requisites:

Participants should have a high school education. No prior experience in semiconductor packaging is required, making this an accessible entry point for those interested in the field.

Equipment, Software or Supplies Needed:

  • Desktop or Laptop (Windows, Mac, LINUX)
  • E-books will be provided

Faculty and course staff

 

Terry Alford

Terry Alford

Interim School Director and Professor School for Engineering of Matter, Transport and Energy

Ira A. Fulton School of Engineering at Arizona State University

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david-theodore

David Theodore

Faculty Associate, School for Engineering of Matter, Transport and Energy

Ira A. Fulton School of Engineering at Arizona State University

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FAQ's

Microcredentials are focused credentials with content designed to provide you with knowledge and specific skills in technical fields. A microcredential badge demonstrates proficiency in a specific skill or attainment of certain knowledge. Our micro-credentials are stackable towards aggregated skills in specific technical topic areas, offering varying levels of complexity (1-4) to provide you with the opportunity to “stack” your skills through into micro-badges and badges along specific topic areas within an emerging technology space!

A badge is earned when successfully completing four approved micro-badges within a specific topic area. A micro-badge is earned by successfully completing one short course and assessment, typically requiring 10 hours of instruction alongside 5-10 hours of additional study. Micro-badges are offered at four distinct levels, culminating with experiential learning activities to ensure you can apply the skills you gain!

A badge is earned when you successfully complete four approved micro-badges within a specific topic area. Each micro-badge is estimated at 10-20 hours of learning time, equating to 40-80 hours for a full badge. 

Navigating the vast landscape of learning options can be daunting, which is why The Fulton Schools of Engineering created a clear and structured leveling system for Micro-badges. Micro-badges are offered in four levels and are designed to guide you through a seamless progression of knowledge and skills, ensuring that each builds upon the last. Whether you're just starting out or looking to advance your expertise, our Micro-badges offer a flexible and customizable learning pathway to suit your needs. Here's how our four levels work: Level 1: Foundational knowledge introduction. Level 2: Introductory practical application within the emerging technology space. Level 3: Skill refinement towards industry-relevant hardware or software. Level 4: Advanced technical skills and troubleshooting with industry-relevant hardware or software.

After successfully completing the requirements of the course. You will receive an email with instructions on accessing your digital badge. Badges can be proudly displayed digitally on social media and referenced on your resume. 

We are committed to providing high-quality programs and are consistently working with faculty and industry experts to develop and deliver courses. We hope to offer more in the coming months and invite you to continue checking back for the latest offerings. If you have recommendations for future topics, please submit them here.

We are happy to work with you to design and deliver a program that addresses the needs of your workforce. In general, we offer a 10% discount to groups of 5 or more employees, and a 20% discount for 10+ employees. Please email us at exec-fseonline@asu.edu for more information on bulk discounts.

Yes, you can enroll in as many badges and micro-badges as you like. We recommend registering for the full badge offerings, which offer a discounted rate for the badge package. 

Depending on the course offering and level of microbadge, there may be skills required to support your success in the course. We recommend reviewing the micro-badge website description for the courses you are interested in, as some skills build upon prior knowledge.

Stackable microcredentials are offered with the flexibility to directly enroll without an admissions process and do not currently provide college credit.

Proudly displaying your newly acquired skills on your resume and social media profile is easy to do! Simply download your badge and add it to your account to signal your skills to hiring managers. The badges can be easily shared on LinkedIn as a digitally verifiable badge.

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