Test & Data Analysis for Quality & Reliability

Gain proficiency in applications and core principles driving semiconductor manufacturing operations and packaging, assembly, and testing.

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This course is included in the ITSI Workforce Accelerator’s Semiconductor Faculty Certification Program. Faculty from ITSI partner countries are encouraged to view this flyer to learn more and request your institution to nominate you today. Faculty accepted into the program will begin by completing the microcredential listed below, followed by additional courses and workshops.

About the ITSI Workforce Accelerator: In collaboration with the U.S. Department of State’s Bureau of Economic and Business (EB) Affairs, Arizona State University (ASU) is implementing a program to help diversify the global semiconductor supply chain. This initiative is supported by the International Technology Security and Innovation (ITSI) Fund, established under the U.S. CHIPS and Science Act of 2022. The initiative seeks to expand semiconductor chip assembly, testing, and packaging (“ATP” or “downstream”) operations in key partner countries in the Americas (Mexico, Costa Rica, and Panama) and the Indo-Pacific (Indonesia, Philippines, and Vietnam), thereby fortifying a resilient supply chain for U.S. semiconductor manufacturers.
 

Introduction

Cultivate a deep understanding of the applications and core principles driving semiconductor operations and advanced modeling techniques. Obtain yourself with the vital skills required by today's electronics industry and transform your approach to package modeling.

This micro-badge is part of the Semiconductor Packaging, Assembly, and Test badge.

Immerse yourself in the semiconductor industry with the "Test & Data Analysis for Quality & Reliability" course, where you will explore the intricacies of electronic package testing. Acquire a comprehensive understanding of how data analysis drives quality, performance, and reliability in modern electronics.

Tailored for forward-thinking individuals, this course equips you with practical skills to thrive in a dynamic field. Master essential testing techniques, delve into effective failure analysis methods, and harness powerful tools for data analysis.

Key Skills Covered:

  • Data collection and analysis from packaging processes
  • Application of Failure Modes, Effects, and Criticality Analysis (FMECA)
  • Interpretation of test conditions for quality and reliability assessment
  • Statistical analysis of test data, such as HALT and HAST, using statistical methods like Weibull distributions

Session Topics:

  • Testing Electronic Packages
  • Manufacturing Data and Statistical Process Control (SPC)
  • Techniques for Conducting Failure Modes, Mechanisms, and Criticality Assessment (FMECA)
  • Test standards like JEDEC, Mil-Spec, and IPC for quality and reliability tests, including Electrical Performance, Thermal Cycling, Preconditioning, and Accelerated Life Tests (HALT and HAST)
  • Techniques for failure analysis, including both destructive and non-destructive methods such as CSAM, FIB, cross-sectioning, microscopy, and CT tomography
  • Techniques for analyzing test data, including statistical distributions like Weibull Analysis

About the course

This course is offered online via Zoom. Instructional sessions will be held:

  • Monday, October 28, 2024, 5:30–9 p.m. MST
  • Tuesday, October 29, 2024, 5:30–9 p.m MST
  • Thursday, October 31, 2024, 5:30–8:30 p.m. MST

Micro Badge Level:

This micro-badge is offered at Level 2. Level 2 micro-badges empower learners to build foundational knowledge and practical skills necessary for entry-level positions in semiconductor packaging.

Explore the Ira A. Fulton Schools of Engineering micro-badge leveling system.

What You’ll Earn:

Participants will earn a micro-badge by completing each micro-badge session and included assessment. Micro-badges are designed with a culminating experiential learning activity ensuring participants can apply the skills learned throughout the course. By completing this micro-badge, participants will also qualify for Continuing Education Units (CEU).

As one of the world’s top-ranked engineering schools, the Ira A. Fulton Schools of Engineering is recognized globally as a premier provider of qualifications.

Pre-requisites:

To be successful in this micro-badge, it is recommended that participants have a basic understanding of physics and engineering principles.

Equipment, Software or Supplies Needed:

  • Computer with Internet access
  • Access to packaging simulation software
  • Basic lab tools for assembly practice
  • Relevant course materials (provided upon enrollment)

Faculty and course staff

 

Terry Alford

Terry Alford

Terry Alford received his doctorate in materials science and engineering from Cornell University in 1991. He joined the Arizona State University faculty in 1993 and is currently a professor and associate director of the School for Engineering of Matter, Transport and Energy in the Ira A. Fulton School of Engineering. Professor Alford's teaching interests include X-ray and electron diffraction, introduction to physical materials science and laboratory, structure and properties of materials, advanced materials issues in semiconductor processing, and materials processing and synthesis. His areas of expertise include silver and copper metallization and low-k dielectrics for future integrated circuit (IC) technologies, advanced metallization for low-power electronics and for novel IC components formation, and adhesion of sol-gel hydroxyapatite-metal systems for biomedical.

  

Christopher Bailey

Christopher Bailey

Christopher Bailey will join ASU as a professor in the School of Electrical, Computer and Energy Engineering. His research expertise is advanced semiconductor packaging, which focuses on multi-physics modeling and reliability. He is the junior-past president of the IEEE Electronics Packaging Society and associate editor for the IEEE Transactions of Components, Packaging, and Manufacturing Technology. Bailey also co-chairs the modeling and simulation technical working group on the Heterogeneous Integration Roadmap.

 

  

david-theodore

Hongbin Yu

Professor Hongbin Yu joined the Arizona State University faculty in 2005. He received a doctorate in physics in 2001 from the University of Texas at Austin, and a master's degree in physics in 1996 from Peking University, P.R. China, and conducted his postdoctoral research at California Institute and Technology and University of California at Los Angeles. He is currently the overall Center Director of NSF IUCRC Center for Efficient Vehicles and Sustainable Transportation Systems (EVSTS: https://evsts.asu.edu). His areas of expertise include nanostructure and nano device fabrication and characterization; flexible, transparent and wearable electronics; wide bandgap semiconductor electronic and optoelectronics; quantum size effect in metallic and semiconducting nanostructures; integrated microwave and power devices, LiDAR and sensors for automotive applications. He is also a member of IEEE/ASME Heterogeneous Integration Roadmap Committee on Automotive Chapter.

 

FAQ's

Microcredentials are focused credentials with content designed to provide you with knowledge and specific skills in technical fields. A microcredential badge demonstrates proficiency in a specific skill or attainment of certain knowledge. Our micro-credentials are stackable towards aggregated skills in specific technical topic areas, offering varying levels of complexity (1-4) to provide you with the opportunity to “stack” your skills through into micro-badges and badges along specific topic areas within an emerging technology space!

A badge is earned when successfully completing four approved micro-badges within a specific topic area. A micro-badge is earned by successfully completing one short course and assessment, typically requiring 10 hours of instruction alongside 5-10 hours of additional study. Micro-badges are offered at four distinct levels, culminating with experiential learning activities to ensure you can apply the skills you gain!

A badge is earned when you successfully complete four approved micro-badges within a specific topic area. Each micro-badge is estimated at 10-20 hours of learning time, equating to 40-80 hours for a full badge. 

Navigating the vast landscape of learning options can be daunting, which is why The Fulton Schools of Engineering created a clear and structured leveling system for Micro-badges. Micro-badges are offered in four levels and are designed to guide you through a seamless progression of knowledge and skills, ensuring that each builds upon the last. Whether you're just starting out or looking to advance your expertise, our Micro-badges offer a flexible and customizable learning pathway to suit your needs. Here's how our four levels work: Level 1: Foundational knowledge introduction. Level 2: Introductory practical application within the emerging technology space. Level 3: Skill refinement towards industry-relevant hardware or software. Level 4: Advanced technical skills and troubleshooting with industry-relevant hardware or software.

After successfully completing the requirements of the course. You will receive an email with instructions on accessing your digital badge. Badges can be proudly displayed digitally on social media and referenced on your resume.

We are committed to providing high-quality programs and are consistently working with faculty and industry experts to develop and deliver courses. We hope to offer more in the coming months and invite you to continue checking back for the latest offerings. If you have recommendations for future topics, please submit them here.

We are happy to work with you to design and deliver a program that addresses the needs of your workforce. In general, we offer a 10% discount to groups of 5 or more employees, and a 20% discount for 10+ employees. Please email us at [email protected] for more information on bulk discounts.

Yes, you can enroll in as many badges and micro-badges as you like. We recommend registering for the full badge offerings, which offer a discounted rate for the badge package. 

Depending on the course offering and level of microbadge, there may be skills required to support your success in the course. We recommend reviewing the micro-badge website description for the courses you are interested in, as some skills build upon prior knowledge.

Stackable microcredentials are offered with the flexibility to directly enroll without an admissions process and do not currently provide college credit.

Proudly displaying your newly acquired skills on your resume and social media profile is easy to do! Simply download your badge and add it to your account to signal your skills to hiring managers. The badges can be easily shared on LinkedIn as a digitally verifiable badge.

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