2D Packaging & Assembly

Gain proficiency in applications and core principles driving semiconductor manufacturing operations and packaging, assembly, and testing.

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This course is included in the ITSI Workforce Accelerator’s Semiconductor Faculty Certification Program. Faculty from ITSI partner countries are encouraged to view this flyer to learn more and request your institution to nominate you today. Faculty accepted into the program will begin by completing the microcredential listed below, followed by additional courses and workshops.

About the ITSI Workforce Accelerator: In collaboration with the U.S. Department of State’s Bureau of Economic and Business (EB) Affairs, Arizona State University (ASU) is implementing a program to help diversify the global semiconductor supply chain. This initiative is supported by the International Technology Security and Innovation (ITSI) Fund, established under the U.S. CHIPS and Science Act of 2022. The initiative seeks to expand semiconductor chip assembly, testing, and packaging (“ATP” or “downstream”) operations in key partner countries in the Americas (Mexico, Costa Rica, and Panama) and the Indo-Pacific (Indonesia, Philippines, and Vietnam), thereby fortifying a resilient supply chain for U.S. semiconductor manufacturers.

Introduction

Develop expertise in the applications and core principles driving semiconductor manufacturing operations and 2D packaging and assembly utilization. Enhance your skillset with the essential skills demanded by today's semiconductor industry and elevate your knowledge of packaging technologies.

This micro-badge is part of the Semiconductor Packaging, Assembly, and Test badge.

Embark on a journey into semiconductor packaging with the 2D Packaging and Assembly micro-badge. Explore the intricacies of material properties and understand their applications in thermal management, stress mitigation, and electrical performance, which are cornerstones of modern semiconductor packaging.

Tailored for forward-thinking individuals ready to embrace the future of semiconductor packaging, this micro-badge equips you with practical skills to thrive in a rapidly evolving landscape. Dive into key topics such as lead frames, wire bonding, flip chip technology, underfill substrates, and PCB assembly. Understand the terminology, key processes, and tools essential for 2D packaging and assembly, and harness the power of advanced materials to optimize package performance.

Key Skills Covered:

Wafer process to chip assembly
Package types, attachment, wire bonding, flip-chip, molding, underfill
Assembly process, tools used
Examples of system-level integration

Session Topics:

Importance of 2D packaging techniques
Types of lead frames and their applications
Lead frame materials and manufacturing processes
Fundamentals of wire bonding
Common failure modes in wire bonding
Advantages and challenges of flip chip technology
Introduction to PCB assembly, inspection and quality control in PCB assembly

About the course

This course is offered online via Zoom. Instructional sessions will be held:

Monday, October 7, 2024, 5:30–9 p.m. MST
Tuesday, October 8, 2024, 5:30–9 p.m. MST
Thursday, October 10, 2024, 5:30–8:30 p.m. MST

Micro Badge Level:

This micro-badge is offered at Level 2. Level 2 micro-badges empower learners to build foundational knowledge and practical skills necessary for entry-level positions in semiconductor packaging.

Explore the Ira A. Fulton Schools of Engineering micro-badge leveling system.

What You’ll Earn:

Participants will earn a micro-badge by completing each micro-badge session and included assessment. Micro-badges are designed with a culminating experiential learning activity ensuring participants can apply the skills learned throughout the course. By completing this micro-badge, participants will also qualify for Continuing Education Units (CEU).

As one of the world’s top-ranked engineering schools, the Ira A. Fulton Schools of Engineering is recognized globally as a premier provider of qualifications.

Pre-requisites:
To be successful in this micro-badge, it is recommended that participants have a basic understanding of physics and engineering principles.

Equipment, Software or Supplies Needed:

Computer with Internet access
Access to packaging simulation software
Basic lab tools for assembly practice
Relevant course materials (provided upon enrollment)

david-theodore

Hongbin Yu

Professor Hongbin Yu joined the Arizona State University faculty in 2005. He received a doctorate in physics in 2001 from the University of Texas at Austin, and a master's degree in physics in 1996 from Peking University, P.R. China, and conducted his postdoctoral research at California Institute and Technology and University of California at Los Angeles. He is currently the overall Center Director of NSF IUCRC Center for Efficient Vehicles and Sustainable Transportation Systems (EVSTS: https://evsts.asu.edu). His areas of expertise include nanostructure and nano device fabrication and characterization; flexible, transparent and wearable electronics; wide bandgap semiconductor electronic and optoelectronics; quantum size effect in metallic and semiconducting nanostructures; integrated microwave and power devices, LiDAR and sensors for automotive applications. He is also a member of IEEE/ASME Heterogeneous Integration Roadmap Committee on Automotive Chapter.

FAQ's

Microcredentials are focused credentials with content designed to provide you with knowledge and specific skills in technical fields. A microcredential badge demonstrates proficiency in a specific skill or attainment of certain knowledge. Our micro-credentials are stackable towards aggregated skills in specific technical topic areas, offering varying levels of complexity (1-4) to provide you with the opportunity to “stack” your skills through into micro-badges and badges along specific topic areas within an emerging technology space!

A badge is earned when successfully completing four approved micro-badges within a specific topic area. A micro-badge is earned by successfully completing one short course and assessment, typically requiring 10 hours of instruction alongside 5-10 hours of additional study. Micro-badges are offered at four distinct levels, culminating with experiential learning activities to ensure you can apply the skills you gain!

A badge is earned when you successfully complete four approved micro-badges within a specific topic area. Each micro-badge is estimated at 10-20 hours of learning time, equating to 40-80 hours for a full badge.

Navigating the vast landscape of learning options can be daunting, which is why The Fulton Schools of Engineering created a clear and structured leveling system for Micro-badges. Micro-badges are offered in four levels and are designed to guide you through a seamless progression of knowledge and skills, ensuring that each builds upon the last. Whether you're just starting out or looking to advance your expertise, our Micro-badges offer a flexible and customizable learning pathway to suit your needs. Here's how our four levels work: Level 1: Foundational knowledge introduction. Level 2: Introductory practical application within the emerging technology space. Level 3: Skill refinement towards industry-relevant hardware or software. Level 4: Advanced technical skills and troubleshooting with industry-relevant hardware or software.

After successfully completing the requirements of the course. You will receive an email with instructions on accessing your digital badge. Badges can be proudly displayed digitally on social media and referenced on your resume.

We are committed to providing high-quality programs and are consistently working with faculty and industry experts to develop and deliver courses. We hope to offer more in the coming months and invite you to continue checking back for the latest offerings. If you have recommendations for future topics, please submit them here.

We are happy to work with you to design and deliver a program that addresses the needs of your workforce. In general, we offer a 10% discount to groups of 5 or more employees, and a 20% discount for 10+ employees. Please email us at [email protected] for more information on bulk discounts.

Yes, you can enroll in as many badges and micro-badges as you like. We recommend registering for the full badge offerings, which offer a discounted rate for the badge package.

Depending on the course offering and level of microbadge, there may be skills required to support your success in the course. We recommend reviewing the micro-badge website description for the courses you are interested in, as some skills build upon prior knowledge.

Stackable microcredentials are offered with the flexibility to directly enroll without an admissions process and do not currently provide college credit.

Proudly displaying your newly acquired skills on your resume and social media profile is easy to do! Simply download your badge and add it to your account to signal your skills to hiring managers. The badges can be easily shared on LinkedIn as a digitally verifiable badge.

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2D Packaging & Assembly

Introduction

About the course

Hongbin Yu

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